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Wastewater Treatment Cmp

Treating chemical mechanical polishing (CMP)

11/04/2005 Chemical mechanical polishing (CMP) process is a conventionally adopted planarization technology in fabricating microchips for integrated circuit (IC) manufacturing. The washing and cleaning step in CMP process consumes as much as 40% of the ultra-pure water used in semiconductor manufacturing and creates a large amount of wastewater,.

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CMP Treatment Ovivo

28/06/2015 CMP or BG wastewater Quality control Discharge CMP and Backgrind Wastewater Treatment CMP Treatment CMP/BG Wastewater Treatment Chemical Mechanical Polishing (CMP) is an essential process in the semiconductor fabrication. CMP wastewater can be treated by flocculation and sedimentation in order to remove the slurry particles. Advantages of Ovivo systems: • H

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Treating chemical mechanical polishing (CMP)

The effect of surfactants on the treatment of chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation (ECF) process was studied. Two surfactants, cetyltrimethylammonium bromide (CTAB) and sodium dodecylsulfate (SDS) were employed in

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Evaluating and treating CMP wastewater

CMP is an effective process to reduce wafer topological imperfections and improve the depth of focus of lithography processes. With the polishing slurry used in the CMP process, a large amount of...

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Wastewater Treatment Pall Corporation

Feed Water (Wastewater) CMP wastewater consists of suspended particles of silica, alumina, and/or cerium oxide, typically ranging in concentration from 0.1% 1% by weight. The silica particles average about 50 150 nm in size; alumina particles have a relatively broad distribution, from about 100 to 300 nm. There are varying amounts of dissolved materials present, such as oxidizing agents,

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Semiconductor Wastewater Treatment

CMP is an essential process in semiconductor fabrication. The resultant wastewater can be treated by flocculation and sedimentation to remove slurry particles. Ovivo’s CMP and backgrind water treatment process guarantees: Minimal chemical consumption and sludge generation; Control of sludge floatation using hydrogen peroxide; Treated water meets stringent discharge requirements . Treatment of Copper CMP Wastewater

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Semiconductor Wastewater Treatment Ovivo

CMP is an essential process in semiconductor fabrication. The resultant wastewater can be treated by flocculation and sedimentation to remove slurry particles. Ovivo’s CMP and backgrind water treatment process guarantees: Minimal chemical consumption and sludge generation; Control of sludge floatation using hydrogen peroxide; Treated water meets stringent discharge requirements . Treatment of Copper CMP Wastewater

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CMPUG-4-Olson Weighing Options for CMP Wastewater Treatment

the more commonly encountered CMP wastewater challenges • Supplemental processes may be required for dd pHOxidant Suspended Solids Copper suspended solids or copper removal Chemical Neutralization Chemical Neutralization Coagulation / Clarification Precipitation Activated Carbon Membrane Filtration Ion Exchange Sludge dewatering Sludge disposal

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Performance assessment of chemical mechanical

18/03/2020 Wastewater from chemical mechanical planarization (CMP) processes in nano-electronics industries must be treated properly in order to fulfil local and international environmental regulations. This study is focused on a performance assessment of membrane distillation (MD) technology for CMP wastewater treatment.

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Treating chemical mechanical polishing (CMP) wastewater by

The effect of surfactants on the treatment of chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation (ECF) the treated CMP wastewater was put in the column with well mixed. After the separation of sludge and liquid was com-pleted (30min), the ratio of the height of the sludge and the height of solution was the sludge percentage of the solution (V s/V ). 3. Results

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Treating chemical mechanical polishing (CMP)

The effect of surfactants on the treatment of chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation (ECF) process was studied. Two surfactants, cetyltrimethylammonium bromide (CTAB) and sodium dodecylsulfate (SDS) were employed in this study to compare the effect of cationic (CTAB) and anodic (SDS) surfactants on ECF. The cationic surfactant can enhance the

More

Evaluating and treating CMP wastewater

CMP is an effective process to reduce wafer topological imperfections and improve the depth of focus of lithography processes. With the polishing slurry used in the CMP process, a large amount of...

More

Wastewater treatment for semiconductor

CMP waste water treatment for semiconductor production. During planarization of the wafer surfaces, waste water is generated that contains grinding aids and mostly copper ions from the removed copper coatings. The used slurries and auxiliaries lead to high concentrations of solid particles in the waste water. In order to be able to discharge the waste water later, the copper ions contained in

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CMP wastewater management using the

Application of design for environment (DfE) concepts to management of wastewater from chemical mechanical polishing (CMP) processes are presented in this paper. Today, DfE is a prevailing concept and is widely adopted by advanced nations in lieu of the traditional “command and control” approach to control waste and toxic emissions.

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Fate of CMP Nanoparticles During Wastewater Treatment

Fate of CMP Nanoparticles During Wastewater Treatment F. Gomez,D. Brown, J. Field, F. Shadman, R. Sierra Dept Chemical and Environmental Engineering The University of Arizona (E-mail: [email protected] ) NSF/SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing

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CMPUG-4-Olson Weighing Options for CMP Wastewater Treatment

the more commonly encountered CMP wastewater challenges • Supplemental processes may be required for dd pHOxidant Suspended Solids Copper suspended solids or copper removal Chemical Neutralization Chemical Neutralization Coagulation / Clarification Precipitation Activated Carbon Membrane Filtration Ion Exchange Sludge dewatering Sludge disposal

More

Performance assessment of chemical mechanical

18/03/2020 Wastewater from chemical mechanical planarization (CMP) processes in nano-electronics industries must be treated properly in order to fulfil local and international environmental regulations. This study is focused on a performance assessment of membrane distillation (MD) technology for CMP wastewater treatment.

More

CMP wastewater reclamation by using an integrated membrane

Chemical mechanical polishing (CMP) is a part of semiconductor manufacturing process, which produces wastewater that contains nano-sized abrasives and ultra-pure water. Due to the large amount of negatively charged colloids suspended in the CMP wastewater, the turbidity is

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Semiconductor Wastewater Treatment and Reuse

would be ideal for fab wastewater facilities [3]. CMP was the first application of the crossover technology. A mixed waste stream of oxide, metal and back-grind was chosen for a pilot system of the EnChem treatment process. The results were compelling enough to warrant recycling tests and ultimately the design and construc-

More

Treating chemical mechanical polishing (CMP)

The effect of surfactants on the treatment of chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation (ECF) process was studied. Two surfactants, cetyltrimethylammonium bromide (CTAB) and sodium dodecylsulfate (SDS) were employed in this study to compare the effect of cationic (CTAB) and anodic (SDS) surfactants on ECF. The cationic surfactant can enhance the

More

Treating chemical mechanical polishing (CMP) wastewater by

The effect of surfactants on the treatment of chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation (ECF) the treated CMP wastewater was put in the column with well mixed. After the separation of sludge and liquid was com-pleted (30min), the ratio of the height of the sludge and the height of solution was the sludge percentage of the solution (V s/V ). 3. Results

More

CMP wastewater management using the

Application of design for environment (DfE) concepts to management of wastewater from chemical mechanical polishing (CMP) processes are presented in this paper. Today, DfE is a prevailing concept and is widely adopted by advanced nations in lieu of the traditional “command and control” approach to control waste and toxic emissions.

More

Wastewater treatment for semiconductor

CMP waste water treatment for semiconductor production. During planarization of the wafer surfaces, waste water is generated that contains grinding aids and mostly copper ions from the removed copper coatings. The used slurries and auxiliaries lead to high concentrations of solid particles in the waste water.

More

Fate of CMP Nanoparticles During Wastewater Treatment

Fate of CMP Nanoparticles During Wastewater Treatment F. Gomez,D. Brown, J. Field, F. Shadman, R. Sierra Dept Chemical and Environmental Engineering The University of Arizona (E-mail: [email protected] ) NSF/SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing

More

CMP wastewater reclamation by using an integrated membrane

processes begin to be applied for treatment and recycling of CMP wastewater. Ultra-filtration (UF) membrane is widely used because it can remove nano-sized particles and produce high quality effluent. There are also many membrane processes like combination of pretreatment in membrane unit or electro-filtration, but the cost of wastewater recycling is still high. If the SiO 2 abrasives could be

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Targeting water use for chemical mechanical

This study determines the feasibility of CMP wastewater treatment by the electrocoagulation process. The COD concentration of the CMP wastewater was found in the range of 700 mg/l which is below

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Interactions of CMP nanoparticles and sewage

Analyzing the affinity of aluminum oxide, cerium oxide, and silicon oxide NPs, which are commonly used in chemical mechanical planarization (CMP) processes, for biosolids used in municipal wastewater treatment plants provides a basis for estimating their removal efficiency.

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Semiconductor Wastewater Treatment and Reuse

would be ideal for fab wastewater facilities [3]. CMP was the first application of the crossover technology. A mixed waste stream of oxide, metal and back-grind was chosen for a pilot system of the EnChem treatment process. The results were compelling enough to warrant recycling tests and ultimately the design and construc-

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Microfiltering Semiconductor Wastewater

Traditional membrane filtration techniques fail when applied to CMP (chemical-mechanical planarization) waste because of the small (sub-100-nm) size of particles in typical CMP wastewater effluent. Even the newer cross-flow filtration techniques have problems with typical CMP flow rates and an intrinsic inability to remove dissolved contaminants.

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